Bonding Period

Progress summary for the May 1-24, 2026 bonding period of the AGL Bluetooth Integration project.

I am happy to share my progress for the three-week bonding period for the AGL Bluetooth and audio integration project.

Status#

Status: Completed

Timeline: May 1, 2026 to May 24, 2026

Environment setup:
- Successfully deployed and configured AGL 21.90.0, vimba, on Raspberry Pi 5.
- Configured remote debugging over SSH for D-Bus and Helvum.
- Set up Visual Studio remote debugging for the Flutter app.
- obexctl was not installed by default, so I manually installed and verified obexctl v5.72 within the AGL image.
Bluetooth profile validation: validated A2DP, AVRCP, HFP, MAP, and PBAP through D-Bus inspection with D-Spy and busctl, plus bluetoothctl and obexctl.
Master branch status: org.pipewire.Telephony is unavailable because the current PipeWire version is v1.0.9.
Blog Setup: finalized the project blog structure and integration guides for the Bluetooth validation workflow.

Next step: begin implementation of org.bluez.Agent1 to enable robust pairing workflows within bluez_native_comms.

Verify BlueZ Stack: profile index for implemented and prepared BlueZ validation workflows.
Profile GAP: adapter power, discovery, pairing, trust, removal, and discoverable mode.
Profile A2DP: media audio connection, BlueZ media transport state, and PipeWire routing checks.
Profile HFP: hands-free call control through the available telephony stack.
Profile PBAP: phone book access through BlueZ OBEX and obexctl.
Profile MAP: message access through BlueZ OBEX and obexctl.
Install OBEX on Yocto: add obexctl and the BlueZ OBEX daemon to an AGL/Yocto image.
Remote D-Bus Inspection: inspect a target system D-Bus from a host PC.
Remote PipeWire Inspection: inspect the target PipeWire graph from a host PC with Helvum.